3-D Microfabrication
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| Audience/Grade: | College Freshman-Continuing Education |
| Discipline(s): |
Electrical Engineering MEMS/NEMS |
| Special Topic(s): | |
| Learning Resource Type: |
Community - General |
| Media Type: |
Unknown |
| Author(s): |
Elliot Hui |
| Description: | Information and further links related to adapting pop-up mechanisms - such as those found in children's storybooks - to achieve assembly of planar components into complex microscale 3-D structures. |
| Rating: |
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| Related Resources | |
| Keywords: | 3-d fold layers pleat MEMS paper pop-up origami |
| Usage Tip | |
| Use of Resource: |
3-D pop up models; similar to origami engineering At the IEEE MEMS 2000 conference in Miyazaki, Japan (MEMS = Micro Elecro Mechanical Systems = teeny machines made using IC fabrication technology), one of the poster papers, by Elliot Hui of UC Berkeley, featured several 3-dimensional pop-up structures fabricated on a silicon wafer. The concept is to deposit flat layers of polysilicon and pattern them like die-cut sheets of paper in a pop-up. Although the sheets of polysilicon are rigid, the process includes a way of making hinges that join adjacent layers, so the layers can fold along pre-selected lines. The process allows multiple layers of "paper" (polysilicon), so the result is very much like a pop-up book. Typical dimensions for these structures are in the few hundred microns (several hair diameters). The piece de resistance of the presentation was an SEM photograph of a tiny 3-D pop-up model of the UCB clock tower, complete with windows, spires, and pyramidal cap. |
| Difficulty: |
Medium |
| Interactivity Level: |
Low |
| Version Info | |
| Publication Date: | May 2000 |
| Platform/Format: |
WWW |
| Cost: |
Free |
| Download URL: | http://bsac2.eecs.berkeley.edu/archive/users/hui-elliot/index.htm |
| Metadata: |
IEEE LOM Record |
| Collection: |
NEEDS
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